Indian Journal of Science and Technology
DOI: 10.17485/ijst/2016/v9i48/108439
Year: 2016, Volume: 9, Issue: 48, Pages: 1-4
Original Article
G. Manikandan1*, G. Murugan1 and K. Raghukandan2
1 Department of Mechanical Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India; [email protected], [email protected] 2 Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India; [email protected]
*Author for correspondence
G. Manikandan
Department of Mechanical Engineering, Annamalai University, Annamalai Nagar – 608 002, Tamil Nadu, India; [email protected]
Objectives: In this study, the heat capacity and heat flow of varied grain size of copper and diamond powders were investigated. Methods: Heat capacity and heat flow of varied grain size of copper (1 µm-70 µm) and diamond powders (2 µm-300 µm) were measured using differential scanning calorimetry (DSC). The thermal properties of copper and diamond powders were determined in a temperature range of 0-500o C, with a heating rate of 5k/min in a nitrogen environment. Findings: Heat capacity and heat flow of copper and diamond powders increases with grain size and it is consistent with earlier researchers. Heat capacity of copper and diamond powders also increases with grain size. The heat capacity and heat flow was 1.4 J/gk and 0.24 mW/mg respectively for 60-70µm grain size of copper powder, whereas the values of the same were found to be 0.9 J/gk and 0.4 mW/mg for diamond powder of grain size in the range of 270 to 300 µm is determined. This study reveals that the diamond powders show better thermal performance over copper powder. Application/Improvements: Determination of thermal behavior is critical in determining the amount of heat transferred in micro electronics and solar thermal based applications.
Keywords: Copper, Diamond, Differential Scanning Calorimetry, Grain Size, Thermal Behavior
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