Indian Journal of Science and Technology
Year: 2016, Volume: 9, Issue: 11, Pages: 1-5
Aleksey Pavlovich Levtsev, Andrey Nikolayevich Makeev and Sergey Fedorovich Kudashev*
*Author for correspondence
Sergey Fedorovich Kudashev
Mechanics and Power Engineering Institute, Chair of Heat-Power Systems, Ogarev Mordovia State University, Saransk, Russia; [email protected]
Background/Objectives: The study is focused on enhancing the capacity of the cooling system applied for the surface of the power semiconductor device based on the use of pulsed thermal medium circulation. Methods/Statistical analysis: The liquid cooling system of the power semiconductor converter was studied by the physical method based on the comparison of parameters of conventional and pulsed coolant circulation modes. During laboratory tests, the experiment was planned in terms of sequence and frequency of changing the device operating modes. The results of experimental studies were processed, and the relationship of discharged heat power and temperature drop versus coolant flow was built using mathematical statistics. Findings: Depending on the discharged heat power and the coolant flow rate in the range of 3–1.5 liter/minute, pulsating heat transfer intensification in the liquid-cooled system of the power semiconductor converter has enabled to enhance heat removal and, respectively, the current load of the power semiconductor converter almost by 2.5 times. At the same time, the coolant circulation in the internal circuit is carried out by hydraulically powered membrane pumps operating due to coolant pressure fluctuations in the external circuit. Applications/Improvements: The presented cooling system makes it possible to increase the heat flow from the power semiconductor converter.
Keywords: Heat Transfer Intensification, Liquid Cooling System, Power Semiconductor Converter, Pulsating Fluid Flow
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