Indian Journal of Science and Technology
Year: 2011, Volume: 4, Issue: 4, Pages: 436-439
G. Venkata Subbaiah1* and K. Vijay Kumar Reddy2
1 Department of Mechanical Engineering SV Govt. Polytechnic, Tirupati–517507, India
2 Department of Mechanical Engineering, JNTU College of Engineering, Kukatpally, Hyderabad-535 003, India
[email protected], [email protected]
As microelectronics technology steadily packing more chip power into small packages, where balance is an important element of success in this electronic enclosure packaging. The design challenges include thermal management, vibration reduction and balancing reliability and maintainability. The present work, the objective is to design Ethernet switch cabinet/enclosure and the faceplate on which the Ethernet switch enclosure is mounted. Design considerations are made according to equipment requirement and IEEE and IEC standards. Sheet metal module in PRO-E is used to create 3D CAD models. The improvements are made on the basis of the results, using finite element analysis (FEA).
Keywords: Microelectronics technology, electronic enclosure packaging, Ethernet switch.
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