Indian Journal of Science and Technology
DOI: 10.17485/ijst/2017/v10i30/115497
Year: 2017, Volume: 10, Issue: 30, Pages: 1-6
Original Article
Rashmi Sharma1*, Rekha Agarwal1 , Ashwani Kumar Dubey2 and Anil Arora3
1Department of Electronics and Commuication, Amity School of Engineering & Technology Bijwasan – 110061, New Delhi, India; [email protected], [email protected] 2Department of Electronics and Communication, Amity University, Noida – 201303, Uttar Pradesh, India; [email protected] 3Department of Electronics and Communication, Thapar University, Patiala – 147004, Punjab, India; [email protected]
*Author for the correspondence:
Rashmi Sharma
Department of Electronics and Commuication, Amity School of Engineering & Technology Bijwasan – 110061, New Delhi, India; [email protected]
The objective of the paper is to design a Microelectronic Mechanical Systems(MEMS) based Capacitive Micromachined Ultrasonic Transducer (CMUT) which has been found to be superior in terms of bandwidth, transduction efficiency and array fabrication as compared to conventional piezoelectric transducers. With the years CMUT has been shown with different element geometries and fabrication techniques, however the optimization techniques and the application areas for the device persist. In this paper CMUT is simulated in COMSOL with Square and Circular diaphragm. FEM analysis is being carried out considering the same area for both the geometries in 3D.CMUT dynamics have been modeled by combining the Electrostatic module, Solid Mechanics Module and Mesh modules in COMSOL. The distributed stress and electric field are measured as function of time. This gives the exact comparison for the Eigen frequency, pull in voltage, deflection with applied DC bias and deflection of the diaphragm with AC superimposed on DC considering the isotropic Silicon as the diaphragm material. This simulation work provides results for the researcher to conclude on the geometry of the device prior to fabrication.
Keywords: Circular, Deflection, Diaphragm, Eigen Frequency, FEM Analysis, Square, Ultrasonic Transducer
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