Study of Reactive Diffusion in Cu/Zn Diffusion Couple

S Khoulif; E B Hannech; N Lamoudi

doi:10.17485/IJST/v15i48.13

Article

Study of Reactive Diffusion in Cu/Zn Diffusion Couple

VIEWS 976
PDF 155

Indian Journal of Science and Technology

DOI: 10.17485/IJST/v15i48.13

Year: 2022, Volume: 15, Issue: 48, Pages: 2740-2747

Original Article

Study of Reactive Diffusion in Cu/Zn Diffusion Couple

S Khoulif¹, E B Hannech^1*, N Lamoudi¹

¹Department of Physics, LESIMS, University Badji Mokhtar, Annaba, Algeria

*Corresponding Author
Email: [email protected]

Received Date:08 January 2022, Accepted Date:04 September 2022, Published Date:27 December 2022

This work is licensed under a Creative Commons Attribution 4.0 International License.

Abstract

Objective: To study the micro structure of the interfacial region of Cu/Zn diffusion couple at 250◦C and its evolution with diffusion time. Methods: The couple was prepared by a diffusion bonding technique and then annealed at 250 ◦C in Argon atmosphere. The micro structure resulting from diffusion reactions in the couple was studied by scanning electron microscopy and energy dispersive X-ray. Findings: Two continuous inter metallic phase layers formed at the interface between Cu and Zn metals. The formed inter metallic were e and g phases of the Cu-Zn system. The g layer grew much faster than the e layer. The growth kinetics of the g phase layer was parabolic with a growth constant kp =(1;90;02)10􀀀13m2s􀀀1. Novelty: This study suggests that reactive diffusion in Cu/Zn diffusion couple occurs according to a model proposed in this paper.

Keywords: Intermetallics; CuZn System; Interdiffusion; Diffusion Couple; Reactive Diffusion

References

Yuan Y, Guan Y, Li D, Moelans N. Investigation of diffusion behavior in Cu-Sn solid state diffusion couples. Journal of Alloys and Compounds. 2016;661:282–293. Available from: https://doi.org/10.1016/j.jallcom.2015.11.214
Wang X, Li D, Li N, Wang R. Growth behavior of intermetallic compounds in Fe/Sn diffusion couples. Journal of Materials Science: Materials in Electronics. 2019;30:12639–12646. Available from: https://doi.org/10.1007/s10854-019-01627-z
Assari AH, Eghbali B. Microstructure and kinetics of intermetallic phase formations during diffusion bonding in bimetal Ti/Al. Physics of metals and metallography. 2019;120:260–268. Available from: https://doi.org/10.1134/S0031918X19030025
Baheti VA, Kashyap S, Kumar P, Chattopadhyay K, Paul A. Solid–state diffusion–controlled growth of the phases in the Au–Sn system. Philosophical Magazine. 2018;98(1):20–36. Available from: https://doi.org/10.1080/14786435.2017.1392052
Adioui N, Hannech EB, Guergueb W, Bououdina M. Intermetallic compound formation in Ni/Sn diffusion couple at atmospheric and 10-8atmospheric pressure. Surface Review and Letters. 2017;24:1850023. Available from: https://doi.org/10.1142/S0218625X18500233
Bernasko PK, Mallik S, Takyi G. Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology. 2015;27(1):52–58. Available from: https://doi.org/10.1108/SSMT-07-2013-0019
Choudhury SF. Intermetallic Compounds and Their Effects on the Mechanical Performance of Micro Scale Solder Bonds. 2016. Available from: https://opencommons.uconn.edu/dissertations/1010
Wang XGG, Dongyuan X, Li JNN, Li XGN. Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing. Materials Research. 2020;23(5). Available from: https://doi.org/10.1590/1980-5373-MR-2020-0325
Wadud MA, Gafur MA, Qadir MR, Rahman MO. Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys. Materials Sciences and Applications. 2015;06(11):1008–1013. Available from: https://doi.org/10.4236/msa.2015.611100
Zhu X, Peng J, Wei X, Yan P, Wang F. Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints. Metals. 2019;9(5):604. Available from: https://doi.org/10.3390/met9050604
Hoxha A, Oettel H, Heger D, Angelopoulos A, Fildisis T. Calculation Of The Interdiffusion Coefficient In The Cu-Zn Diffusion Couple. AIP Conference Proceedings. 2010;1203(1):591. Available from: https://doi.org/10.1063/1.3322515
Hoxha A, Jani J. The diffusion coefficients of Cu and Zn in A and H-Solid Solutions. International journal of Science and Technology Research. 2015;4(6). Available from: http://www.ijstr.org/final-print/june2015/The-Diffusion-Coefficients-Of-Cu-And-Zn-In-913-And-919-Solid-Solutions.pdf
Shimozaki T, Lee JHG, Lee CGG. Movement of Multiple Markers in Cu/Zn Multiple Phase Diffusion Couples and Its Numerical Analysis. Journal of Phase Equilibria and Diffusion. 2016;37(5):548–555. Available from: https://doi.org/10.1007/s11669-016-0479-6
Takamatsu Y, Kajihara M. Kinetics of Solid-State Reactive Diffusion in the Cu/Zn System. Materials Transactions. 2017;58(1):16–22. Available from: https://doi.org/10.2320/matertrans.M2016278
Ke L, Ding W, Tao X, Chen H, Ouyang Y, Du Y. Diffusion behaviors and mechanical properties of Cu-Zn system. Journal of Alloys and Compounds. 2020;812:152141. Available from: https://doi.org/10.1016/j.jallcom.2019.152141
Eastman CM, Zhang Q, Zhao JCC. Diffusion Coefficients and Phase Equilibria of the Cu-Zn Binary System Studied Using Diffusion Couples. Journal of Phase Equilibria and Diffusion. 2020;41(5):642–653. Available from: https://doi.org/10.1007/s11669-020-00831-3
Dybkov VI. Reaction diffusion in heterogeneous binary systems, Part. 1: Growth of the chemical compound layers at the interface between two elementary substances: one compound layer. Journal of Materials Science. 1986;21(9):3078–3084. Available from: https://doi.org/10.1007/BF00553339

Copyright

© 2022 Khoulif et al. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited. Published By Indian Society for Education and Environment (iSee)