Indian Journal of Science and Technology
Year: 2022, Volume: 15, Issue: 48, Pages: 2740-2747
S Khoulif1, E B Hannech1*, N Lamoudi1
1Department of Physics, LESIMS, University Badji Mokhtar, Annaba, Algeria
Email: [email protected]
Received Date:08 January 2022, Accepted Date:04 September 2022, Published Date:27 December 2022
Objective: To study the micro structure of the interfacial region of Cu/Zn diffusion couple at 250◦C and its evolution with diffusion time. Methods: The couple was prepared by a diffusion bonding technique and then annealed at 250 ◦C in Argon atmosphere. The micro structure resulting from diffusion reactions in the couple was studied by scanning electron microscopy and energy dispersive X-ray. Findings: Two continuous inter metallic phase layers formed at the interface between Cu and Zn metals. The formed inter metallic were e and g phases of the Cu-Zn system. The g layer grew much faster than the e layer. The growth kinetics of the g phase layer was parabolic with a growth constant kp =(1;90;02)1013m2s1. Novelty: This study suggests that reactive diffusion in Cu/Zn diffusion couple occurs according to a model proposed in this paper.
Keywords: Intermetallics; CuZn System; Interdiffusion; Diffusion Couple; Reactive Diffusion
© 2022 Khoulif et al. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited. Published By Indian Society for Education and Environment (iSee)
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