Indian Journal of Science and Technology
Year: 2016, Volume: 9, Issue: Special Issue 1, Pages: 1-6
Gurleen Dhillon and Neha Raghu*
School of Electrical and Electronics Engineering, Lovely Professional University Phagwara - 144411, Punjab, India; [email protected]
*Author for correspondence
School of Electrical and Electronics Engineering
The work in this paper analyses the performance of Single Wall Carbon Nanotube (SWCNT) bundles as VLSI interconnect. Using equivalent RLC circuit models described in this paper, comprehensive analysis of delay and power is done at 22nm technology node for both SWCNT bundle and copper. Results show that SWCNT bundle has smaller value of resistance due to longer mean free path and lesser delay than copper. Therefore, SWCNT bundle is a promising alternative to copper as VLSI interconnect for advanced technology nodes.
Keywords: Carbon Nanotubes, Electromigration, Grain Boundary Scattering, Nanotechnology
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