Indian Journal of Science and Technology
Year: 2021, Volume: 14, Issue: 1, Pages: 55-70
Original Article
Savita1*, Ravinder Kumar Sahrawat1, Meenal Malik2
1Department of Mathematics, Deenbandhu Chhotu Ram University of Science and Technology, Murthal, 131039, India. Tel.: 8397883690
2Department of Mathematics, All India Jat Heroes Memorial College, Rohtak, 124001, India
*Corresponding Author
Tel: 8397883690
Email: [email protected]
Received Date:16 October 2021, Accepted Date:01 January 2021, Published Date:13 January 2021
Objective: To study the stresses due to strip load in a monoclinic elastic plate placed over an irregular monoclinic elastic half space. Method: Antiplane strain problem with different interfacing boundary conditions namely “perfectly welded interfacing, smooth-rigid interfacing, rough-rigid interfacing” has been considered and Fourier Transformation is used on the equilibrium equations to obtain the solutions. Findings: The displacements and stressesare obtained for each boundary condition and the variation of shearing stresses with horizontal distance are studied due to different size of rectangular shaped irregularity at any point of the medium consisting of monoclinic elastic plate placed upon an irregular monoclinic elastic half space. The comparison between the stresses for different types of interfacing has been made graphically. Novelty: The static deformation of two or more connected elastic mediums with irregularities due to surface loads has been studied earlier but just a few have showed graphic representation of stresses with irregularity in different sizes. Keeping in mind the shortcomings of earlier work done, the present paper visualizes shearing stresses in both theoretical and graphical manners completely.
Keywords: Monoclinic; strip loading; anti plane strain; rectangular irregularity
© 2021 Savita et al.This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited. Published By Indian Society for Education and Environment (iSee)
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